Numerical simulation of vertical tunnelling field-effect transistors charge-trapping memory with TCAD tools
- 28 January 2021
- journal article
- research article
- Published by IOP Publishing in Semiconductor Science and Technology
- Vol. 36 (4), 045013
- https://doi.org/10.1088/1361-6641/abe0f6
Abstract
A novel vertical tunnelling field-effect transistor (TFET) based on silicon-oxide-nitride-oxide-silicon (SONOS) non-volatile memory device, named as VT-SONOS, is proposed and investigated using TCAD simulations. Different from traditional planar TFET-based SONOS memory, the VT-SONOS device is programmed via band-to-band tunnelling for vertical pocket and Fowler–Nordheim tunnelling for both pocket/bottom oxide (OXb) and channel/OXb regions, which leads to a steeper subthreshold swing (SS) and a larger on-state current (I ON). The device structure is constructed using Sentaurus TCAD tools, and I D–V G characteristics were extracted using TCAD tools. Obtained SS value is 102.09 mV dec−1, while the I ON was 3.02 × 10−4 A. The memory window was 2.95 V, showing more dependence on programming pulse height (V gp) than erasing pulse height (V ge). Furthermore, 10-year retention characteristics were studied to investigate critical reliability issue. About 60% of the initial trapped charges remained in the device after unbiased 3.15 × 108 s (10 years) storage.Keywords
Funding Information
- Key R&D Plan of Guangdong Province (2019B010145001)
- National Natural Science Foundation of China (61634008)
- Youth Innovation Promotion Association of the Chinese Academy of Sciences (2014101)
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