Hot-Electron-Related Degradation in InAlN/GaN High-Electron-Mobility Transistors
- 8 July 2014
- journal article
- research article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Electron Devices
- Vol. 61 (8), 2793-2801
- https://doi.org/10.1109/ted.2014.2332235
Abstract
Hot-electron temperature (Te) in InAlN/GaN high-electron-mobility transistors (HEMTs) was determined using electroluminescence spectroscopy as a function of gate voltage and correlated with the Te distribution determined by hydrodynamic simulations. Good agreement between measurement and simulations suggests that hot electrons can locally reach temperatures of up to 30000 K at V ds = 30 V, i.e., two to three times higher than that typically obtained for similar AlGaN/GaN HEMTs. The consequence of such high T e in InAlN/GaN HEMTs is illustrated by electrical stressing in OFF and semi-ON state at V gd = 100 V. Prominent channel degradation was observed for devices stressed in semi-ON state, suggesting hot-electron driven degradation. Threshold voltage and drain current transient analyses indicate that hot electrons increase the density of traps in the GaN channel underneath the gate as well as surface/interface traps located in the gate-to-drain access region.Keywords
Funding Information
- Research and Development Operational Program, European Regional Development Fund, through the Project Competence Center for New Materials, Advanced Technologies, and Energy (ITMS 26240220073 (1/2))
- European Commission through the MORGAN Project (FP7 NMP IP 214610)
- Slovak Research and Development Agency (APVV-0104010)
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