Total Ionizing Dose Effects on Strained Ge pMOS FinFETs on Bulk Si
Open Access
- 2 December 2016
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Nuclear Science
- Vol. 64 (1), 226-232
- https://doi.org/10.1109/tns.2016.2635023
Abstract
We have characterized the total ionizing dose response of strained Ge $p$ MOS FinFETs built on bulk Si using a fin replacement process. Devices irradiated to 1.0 Mrad(SiO2) show minimal transconductance degradation (less than 5%), very small $\text {V}_{th}$ shifts (less than 40 mV in magnitude) and very little ON/OFF current ratio degradation (<5%), and only modest variation in radiation response with transistor geometry (typically less than normal part-to-part variation). Both before and after irradiation, the performance of these strained Ge $p$ MOS FinFETs is far superior to that of past generations of planar Ge $p$ MOS devices. These improved properties result from significant improvements in processing technology, as well as the enhanced gate control provided by the strained Ge FinFET technology.
Keywords
Funding Information
- AFRL and AFOSR through the Hi-REV Program
- Defense Threat Reduction Agency through its Basic Research program
- Department of Energy, Office of Science, Basic Energy Sciences, Materials Sciences and Engineering Division (DE-FG02-09ER46554)
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