Review on the effect of Gallium in solder alloy
Open Access
- 1 October 2020
- journal article
- review article
- Published by IOP Publishing in IOP Conference Series: Materials Science and Engineering
- Vol. 957 (1), 012054
- https://doi.org/10.1088/1757-899x/957/1/012054
Abstract
Soldering is a well-known metallurgical joining method that uses a filler metal, the solder, with a melting point below 425°C. The trends toward to miniaturization in microelectronic packaging industries have motivated the development of high performance lead-free solders. However, the properties of the lead free solder cannot match the properties of lead solder. To overcome this problem, a dopant is added to the based lead free solder. In this paper, review on the effect of Gallium as doped was discussed.This publication has 9 references indexed in Scilit:
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