Zn-Al-Mg-Ga alloys as Pb-free solder for die-attaching use
- 1 November 1999
- journal article
- research article
- Published by Springer Science and Business Media LLC in Journal of Electronic Materials
- Vol. 28 (11), 1172-1175
- https://doi.org/10.1007/s11664-999-0153-4
Abstract
No abstract availableKeywords
This publication has 1 reference indexed in Scilit:
- The mechanism of intergranular corrosion of dilute zinc-aluminium alloys in hot waterCorrosion Science, 1976