Wettability and strength of In–Bi–Sn lead-free solder alloy on copper substrate
- 24 September 2010
- journal article
- research article
- Published by Elsevier BV in Journal of Alloys and Compounds
- Vol. 507 (1), 290-296
- https://doi.org/10.1016/j.jallcom.2010.07.182
Abstract
No abstract availableKeywords
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