The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures
Top Cited Papers
- 24 September 2010
- journal article
- Published by Elsevier BV in Journal of Alloys and Compounds
- Vol. 507 (1), 215-224
- https://doi.org/10.1016/j.jallcom.2010.07.160
Abstract
No abstract availableKeywords
This publication has 28 references indexed in Scilit:
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