Effect of micron size Ni particle addition in Sn–8Zn–3Bi lead-free solder alloy on the microstructure, thermal and mechanical properties
- 1 February 2014
- journal article
- Published by Elsevier BV in Journal of Alloys and Compounds
- Vol. 585, 32-39
- https://doi.org/10.1016/j.jallcom.2013.09.131
Abstract
No abstract availableThis publication has 33 references indexed in Scilit:
- Microstructure and mechanical properties of Sn–Bi, Sn–Ag and Sn–Zn lead-free solder alloysJournal of Alloys and Compounds, 2013
- The effects of temperature and humidity on the growth of tin whisker and hillock from Sn5Nd alloyJournal of Alloys and Compounds, 2013
- Effects of Pd concentration on the interfacial reaction and mechanical reliability of the Sn–Pd/Ni systemJournal of Alloys and Compounds, 2011
- Effect of antimony on vigorous interfacial reaction of Sn–Sb/Te couplesJournal of Alloys and Compounds, 2011
- Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn–9Zn binary eutectic solder alloyMicroelectronics Reliability, 2010
- Effect of La addition on the interfacial intermetallics and bonding strengths of Sn–58Bi solder joints with Au/Ni/Cu padsJournal of Alloys and Compounds, 2010
- Interfacial reaction of gas-atomized Sn–Zn solder containing Ni and Cu additivesJournal of Alloys and Compounds, 2009
- Development of gold based solder candidates for flip chip assemblyMicroelectronics Reliability, 2009
- An investigation of Sn pest in pure Sn and Sn-based soldersMicroelectronics Reliability, 2009
- Phase transformation and morphology of the intermetallic compounds formed at the Sn–9Zn–3.5Ag/Cu interface in agingJournal of Alloys and Compounds, 2008