Porous low dielectric constant materials for microelectronics
- 29 November 2005
- journal article
- review article
- Published by The Royal Society in Philosophical Transactions of the Royal Society A: Mathematical, Physical and Engineering Sciences
- Vol. 364 (1838), 201-215
- https://doi.org/10.1098/rsta.2005.1679
Abstract
Materials with a low dielectric constant are required as interlayer dielectrics for the on-chip interconnection of ultra-large-scale integration devices to provide high speed, low dynamic power dissipation and low cross-talk noise. The selection of chemical compounds with low polarizability and the introduction of porosity result in a reduced dielectric constant. Integration of such materials into microelectronic circuits, however, poses a number of challenges, as the materials must meet strict requirements in terms of properties and reliability. These issues are the subject of the present paper.Keywords
This publication has 17 references indexed in Scilit:
- Pre-Stirring Promotes Nucleation of Protein CrystalsJapanese Journal of Applied Physics, 2004
- Porosity in plasma enhanced chemical vapor deposited SiCOH dielectrics: A comparative studyJournal of Applied Physics, 2003
- Low dielectric constant materials for microelectronicsJournal of Applied Physics, 2003
- Plasma enhanced chemical vapor deposited SiCOH dielectrics: from low-k to extreme low-k interconnect materialsJournal of Applied Physics, 2003
- Pore size distributions in low‐k dielectric thin films from X‐ray porosimetryJournal of Polymer Science Part B: Polymer Physics, 2002
- Processing dependent thermal conductivity of nanoporous silica xerogel filmsJournal of Applied Physics, 2002
- Effects of processing history on the modulus of silica xerogel filmsJournal of Applied Physics, 2001
- Comparative Study of Pore Size of Low-Dielectric-Constant Porous Spin-on-Glass Films Using Different Methods of Nondestructive InstrumentationJapanese Journal of Applied Physics, 2001
- Properties of nanoporous silica thin films determined by high-resolution x-ray reflectivity and small-angle neutron scatteringJournal of Applied Physics, 2000
- Structural Change in Porous Silica Thin Film after Plasma TreatmentElectrochemical and Solid-State Letters, 1999