Analysis of a pre-stressed bi-material accelerated-life-test (ALT) specimen
- 16 December 2010
- journal article
- research article
- Published by Wiley in ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik
- Vol. 91 (5), 371-385
- https://doi.org/10.1002/zamm.201000101
Abstract
No abstract availableKeywords
This publication has 34 references indexed in Scilit:
- Predictive Analytical Thermal Stress Modeling in Electronics and PhotonicsApplied Mechanics Reviews, 2009
- An assessment of five modeling approaches for thermo-mechanical stress analysis of laminated composite panelsComputational Mechanics, 2000
- A device life cycle analysis of the WSI associative string processorIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1995
- Elastoplastic Analysis of Bimaterial Beams Subjected to Thermal LoadsJournal of Electronic Packaging, 1991
- Thermal Stresses in Layered Electrical Assemblies Bonded With SolderJournal of Electronic Packaging, 1991
- Stress Relief in Solder Joints Due to the Application of a Flex CircuitJournal of Electronic Packaging, 1991
- Deformation in Multilayer Stacked AssembliesJournal of Electronic Packaging, 1990
- Realistic Modeling of Edge Effect Stresses in Bimaterial ElementsJournal of Electronic Packaging, 1990
- An internal variable constitutive model for hot working of metalsInternational Journal of Plasticity, 1989
- Constitutive equations for hot-working of metalsInternational Journal of Plasticity, 1985