Pressureless Bonding by Micro-Sized Silver Particle Paste for High-Temperature Electronic Packaging
- 1 January 2016
- journal article
- Published by Japan Institute of Metals in MATERIALS TRANSACTIONS
- Vol. 57 (7), 1209-1214
- https://doi.org/10.2320/matertrans.md201513
Abstract
No abstract availableThis publication has 22 references indexed in Scilit:
- Fatigue and dwell-fatigue behavior of nano-silver sintered lap-shear joint at elevated temperatureMicroelectronics Reliability, 2014
- Mechanical properties of nano-silver joints as die attach materialsJournal of Alloys and Compounds, 2012
- Current Problems and Possible Solutions in High-Temperature Lead-Free SolderingJournal of Materials Engineering and Performance, 2012
- A Low-Temperature Pressureless Bonding Process Using a Trimodal Mixture System of Ag NanoparticlesJournal of Electronic Materials, 2011
- Die Attach Materials for High Temperature Applications: A ReviewIEEE Transactions on Components, Packaging and Manufacturing Technology, 2011
- Carboxylate-Passivated Silver Nanoparticles and Their Application to Sintered Interconnection: A Replacement for High Temperature Lead-Rich SoldersJournal of Electronic Materials, 2010
- Low-Temperature Sintering with Nano-Silver Paste in Die-Attached InterconnectionJournal of Electronic Materials, 2007
- Electronics Without LeadScience, 2005
- Metal–metal bonding process using Ag metallo-organic nanoparticlesActa Materialia, 2005
- Thermal behavior of silver nanoparticles for low-temperature interconnect applicationsJournal of Electronic Materials, 2005