Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection
Top Cited Papers
- 11 September 2007
- journal article
- Published by Springer Science and Business Media LLC in Journal of Electronic Materials
- Vol. 36 (10), 1333-1340
- https://doi.org/10.1007/s11664-007-0230-5
Abstract
No abstract availableKeywords
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