Thermal behavior of silver nanoparticles for low-temperature interconnect applications
Top Cited Papers
- 1 February 2005
- journal article
- Published by Springer Science and Business Media LLC in Journal of Electronic Materials
- Vol. 34 (2), 168-175
- https://doi.org/10.1007/s11664-005-0229-8
Abstract
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This publication has 6 references indexed in Scilit:
- Molecular dynamics study on the coalescence of Cu nanoparticles and their deposition on the Cu substrateJournal of Electronic Materials, 2004
- Improvement of adhesion and electrical properties of reworkable thermoplastic conductive adhesivesJournal of Adhesion Science and Technology, 2003
- Combustion chemical vapor deposition: A novel thin-film deposition techniqueApplied Physics Letters, 1993
- Small particle melting of pure metalsThin Solid Films, 1986
- Embedded-atom method: Derivation and application to impurities, surfaces, and other defects in metalsPhysical Review B, 1984
- Semiempirical, Quantum Mechanical Calculation of Hydrogen Embrittlement in MetalsPhysical Review Letters, 1983