Towards a deeper understanding of plastic deformation in mono-crystalline silicon
- 1 September 2001
- journal article
- Published by Elsevier BV in International Journal of Mechanical Sciences
- Vol. 43 (9), 1985-1996
- https://doi.org/10.1016/s0020-7403(01)00024-8
Abstract
No abstract availableThis publication has 20 references indexed in Scilit:
- Molecular dynamics simulation of phase transformations in silicon monocrystals due to nano-indentationNanotechnology, 2000
- Oxygen Precipitation Behavior in 300 mm Polished Czorchralski Silicon WafersJournal of the Electrochemical Society, 1999
- Ultra-micro-indentation of silicon and compound semiconductors with spherical indentersJournal of Materials Research, 1999
- On the Mechanics and Physics in the Nano-Indentation of Silicon Monocrystals.JSME International Journal Series A, 1999
- Effect of ultraprecision grinding on the microstructural change in silicon monocrystalsJournal of the American Academy of Dermatology, 1998
- High resolution studies of crystalline damage induced by lapping and single-point diamond machining of Si(100)Journal of Materials Research, 1996
- Subsurface Damage in Single Diamond Tool Machined SI WafersMaterials Science Forum, 1995
- Changes in surface area and composition during grinding of silicon in environments of various qualityJournal of Materials Research, 1995
- The extent of phase transformation in silicon hardness indentationsJournal of Materials Research, 1992
- The Determination of Surface Plastic and Elastic Properties by Ultra Micro-indentationMetrologia, 1991