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Subsurface Damage in Single Diamond Tool Machined SI Wafers
Home
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Subsurface Damage in Single Diamond Tool Machined SI Wafers
Subsurface Damage in Single Diamond Tool Machined SI Wafers
TM
Teimuraz Mchedlidze
Teimuraz Mchedlidze
IY
Ichiro Yonenaga
Ichiro Yonenaga
KS
Koji Sumino
Koji Sumino
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1 November 1995
journal article
Published by
Trans Tech Publications, Ltd.
in
Materials Science Forum
Vol. 196-201
,
1841-1846
https://doi.org/10.4028/www.scientific.net/msf.196-201.1841
Abstract
No abstract available
Keywords
DUCTILE MODE GRINDING
SURFACE DAMAGE
Cited by 12 articles