Plasma-etching-enhanced deep centers in n-GaN grown by metalorganic chemical-vapor deposition
- 10 March 2003
- journal article
- research article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 82 (10), 1562-1564
- https://doi.org/10.1063/1.1560562
Abstract
By using deep-level transient spectroscopy(DLTS), deep centers have been characterized in unintentionally doped n- GaN samples grown by metalorganic chemical-vapor deposition and subjected to inductively coupled plasma reactive ion etching. At least six DLTS traps exist in the control sample: A 1 (∼0.90 eV), A x (∼0.72 eV), B (0.61 eV), C 1 (0.44 eV), D (0.25 eV), and E 1 (0.17 eV), with B dominant. Then, as the etching bias-voltage increases from −50 to −150 V, trap D increases strongly and becomes dominant, while traps A 1 , C (0.34 eV), and E 1 increase at a slower rate. Trap B, on the other hand, is nearly unchanged. Previous electron-irradiation studies are consistent with the E 1 traps being N-vacancy related. It is likely that the D traps are also, except that they are in the regions of dislocations.Keywords
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