Schottky diode measurements of dry etch damage in n- and p-type GaN
- 1 July 2000
- journal article
- Published by American Vacuum Society in Journal of Vacuum Science & Technology A
- Vol. 18 (4), 1144-1148
- https://doi.org/10.1116/1.582314
Abstract
n- and p-type GaN was exposed to inductively coupled plasma of Ar, or as a function of source power (0–1000 W) and rf chuck power (20–250 W). For n-GaN, there was a strong reduction in diode reverse breakdown voltage and an increase in forward and reverse currents, while for p-GaN the reverse breakdown voltage increased. These results are consistent with creation of point defects with shallow donor nature that increase the conductivity of initially n-type GaN or decrease the conductivity of p-type GaN. Annealing at 750 °C under produced significant recovery of the electrical properties, while wet etch removal of 500–600 Å of the surface produced a full recovery. For completed n-type mesa diodes exposed to Ar or discharges, the low bias forward currents increased by several orders of magnitude. The exposed surfaces became deficient in all cases.
Keywords
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