Numerical modeling of the transient liquid phase bonding process of Ni using Ni-B-Cr ternary filler metal
- 1 May 1999
- journal article
- Published by Springer Science and Business Media LLC in Journal of Phase Equilibria and Diffusion
- Vol. 20 (3), 199-206
- https://doi.org/10.1361/105497199770335721
Abstract
No abstract availableKeywords
This publication has 12 references indexed in Scilit:
- A diffusional model for transient liquid phase bondingActa Materialia, 1997
- The influence of base metal grain size on isothermal solidification during transient liquid-phase brazing of nickelJournal of Materials Science, 1993
- Liquid- solid interface migration at grain boundary regions during transient liquid phase brazingMetallurgical Transactions A, 1992
- Microstructural development in transient liquid-phase bondingMetallurgical Transactions A, 1991
- Effect of grain boundaries on isothermal solidification during transient liquid phase brazingMetallurgical Transactions A, 1991
- Modeling of base metal dissolution behavior during transient liquid-phase brazingMetallurgical Transactions A, 1991
- Influence of Delta-ferrite on Sensitization of the Austenitic Stainless Steel Weld Metal.QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY, 1991
- Study on trasient liquid insert metal diffusion bonding of Ni base superalloys. (Part 3). Metallurgical study of TLIM bonding.QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY, 1989
- A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich jointMetallurgical Transactions A, 1988
- The Thermo-Calc databank systemCalphad, 1985