Microstructural development in transient liquid-phase bonding
- 1 October 1991
- journal article
- Published by Springer Science and Business Media LLC in Metallurgical Transactions A
- Vol. 22 (10), 2451-2457
- https://doi.org/10.1007/bf02665011
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich jointMetallurgical Transactions A, 1988
- Das Dreistoffsystem Nickel?Chrom?BorMonatshefte für Chemie / Chemical Monthly, 1974