A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich joint
- 1 March 1988
- journal article
- Published by Springer Science and Business Media LLC in Metallurgical Transactions A
- Vol. 19 (3), 675-686
- https://doi.org/10.1007/bf02649282
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Diffusion in Copper and Copper Alloys, Part II. Copper-Silver and Copper-Gold SystemsJournal of Physical and Chemical Reference Data, 1974
- Diffusion of Monovalent Solutes in Liquid Copper and SilverJournal of the Japan Institute of Metals and Materials, 1973