Transient Liquid Phase Process in Ni–B Joining
- 1 January 1997
- journal article
- Published by Japan Institute of Metals in Materials Transactions, JIM
- Vol. 38 (10), 886-891
- https://doi.org/10.2320/matertrans1989.38.886
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- Liquid Phase Diffusion Bonding of Rene80 Using Pure BoronMaterials Transactions, JIM, 1996
- Study on transient liquid insert metal diffusion bonding of Ni-base superalloys. (Part 2). Analysis of isothermal solidification process on transient liquid insert metal diffusion bonding.QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY, 1989
- A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich jointMetallurgical Transactions A, 1988