Wetting and interface microstructure between Sn–Zn binary alloys and Cu
- 1 October 1998
- journal article
- Published by Springer Science and Business Media LLC in Journal of Materials Research
- Vol. 13 (10), 2859-2865
- https://doi.org/10.1557/jmr.1998.0391
Abstract
No abstract availableThis publication has 9 references indexed in Scilit:
- Environmentally Conscious Engineering in Electronics. 1. Properties of Sn-Ag Binary Alloy as Lead Free Solder and Interface Microstructure with Cu.The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits, 1996
- Microstructure and Strength of Interface between Sn-Ag Eutectic Solder and CuJournal of the Japan Institute of Metals and Materials, 1995
- In search of new lead-free electronic soldersJournal of Electronic Materials, 1994
- ForewordJournal of Electronic Materials, 1994
- New, lead-free soldersJournal of Electronic Materials, 1994
- A viable tin-lead solder substitute: Sn-Ag-CuJournal of Electronic Materials, 1994
- The effect of reflow process variables on the wettability of lead-free soldersJOM, 1993
- Progress in the design of new lead-free solder alloysJOM, 1993
- Constitution of Binary AlloysJournal of the Electrochemical Society, 1958