A viable tin-lead solder substitute: Sn-Ag-Cu
- 1 July 1994
- journal article
- Published by Springer Science and Business Media LLC in Journal of Electronic Materials
- Vol. 23 (7), 595-601
- https://doi.org/10.1007/bf02653344
Abstract
No abstract availableThis publication has 7 references indexed in Scilit:
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