The wettability and microstructure of Sn-Zn-RE alloys
- 1 February 2003
- journal article
- research article
- Published by Springer Science and Business Media LLC in Journal of Electronic Materials
- Vol. 32 (2), 63-69
- https://doi.org/10.1007/s11664-003-0238-4
Abstract
No abstract availableKeywords
This publication has 8 references indexed in Scilit:
- The properties of Sn-9Zn lead-free solder alloys doped with trace rare earth elementsJournal of Electronic Materials, 2002
- Microstructure and mechanical properties of new lead-free Sn-Cu-RE solder alloysJournal of Electronic Materials, 2002
- The Effect of Bi Concentration on Wettability of Cu Substrate by Sn-Bi SoldersMATERIALS TRANSACTIONS, 2001
- Flux development for lead-free solders containing zincJournal of Electronic Materials, 2000
- Heat Resistance of Sn–9Zn Solder/Cu Interface with or without CoatingJournal of Materials Research, 2000
- Interfacial reactions of tin‐zinc‐bismuth alloysSoldering & Surface Mount Technology, 1999
- Wetting and interface microstructure between Sn–Zn binary alloys and CuJournal of Materials Research, 1998
- New lead-free, Sn-Zn-In solder alloysJournal of Electronic Materials, 1994