Thermal Transient Testing
- 1 August 1997
- journal article
- Published by Emerald in Microelectronics International
- Vol. 14 (2), 8-10
- https://doi.org/10.1108/13565369710800529
Abstract
Thermal issues are becoming increasingly serious with the scaling down of integrated circuits and the increasing density brought in by advanced packaging techniques. Consequently, thermal issues need to be considered during both design and test. The present paper addresses thermal testing, and more specifically thermal transient testing.Keywords
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