Optimized Circuit Failure Prediction for Aging: Practicality and Promise

Abstract

Circuit failure prediction is used to predict occurrences of circuit failures, during system operation, before errors appear in system data and states. This technique is applicable for overcoming major scaled-CMOS reliability challenges posed by aging mechanisms such as Negative-Bias-Temperature-Instability (NBTI). This is possible because of the gradual nature of degradation associated with such aging mechanisms. Circuit failure prediction uses special on-chip circuits called aging sensors. In this paper, we experimentally demonstrate correct functionality and practicality of two flavors of flip-flop designs with built-in aging sensors using 90 nm test chips. We also present an aging-aware timing analysis technique to strategically place such flip-flops with built-in aging sensors at selective locations inside a chip for effective circuit failure prediction. This aging-aware timing analysis approach also minimizes the chip-level area impact of such aging sensors. Results from two 90 nm designs demonstrate the practicality and effectiveness of optimized circuit failure prediction with overall chip-level area impact of 2.5% and 0.6%.