Using polydimethylsiloxane as a thermocurable resist for a soft imprint lithography process
- 31 July 2002
- journal article
- Published by Elsevier BV in Microelectronic Engineering
- Vol. 61-62, 379-384
- https://doi.org/10.1016/s0167-9317(02)00573-7
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- Nanoreplication in polymers using hot embossing and injection moldingMicroelectronic Engineering, 2000
- Siloxane Polymers for High-Resolution, High-Accuracy Soft LithographyMacromolecules, 2000
- Thermocurable polymers as resists for imprint lithographyElectronics Letters, 2000
- SOFT LITHOGRAPHYAnnual Review of Materials Science, 1998
- Sub-10 nm imprint lithography and applicationsJournal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 1997