IC failure analysis: techniques and tools for quality reliability improvement
- 1 May 1993
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in Proceedings of the IEEE
- Vol. 81 (5), 703-715
- https://doi.org/10.1109/5.220902
Abstract
The role of failure analysis is discussed. Failure analysis techniques and tools, including electrical measurements, optical microscopy, thermal imaging analysis, electron beam techniques, light emission microscopy, ion beam techniques, and scanning probe microscopy, are reviewed. Opportunities for advances in the field of IC failure analysis are considered.<>Keywords
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