Study of contact resistivity, mechanical integrity, and thermal stability of Ti/Al and Ta/Al ohmic contacts to n-type GaN
- 1 April 1998
- journal article
- Published by Springer Science and Business Media LLC in Journal of Electronic Materials
- Vol. 27 (4), 196-199
- https://doi.org/10.1007/s11664-998-0386-7
Abstract
No abstract availableKeywords
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