Impact of multiple-detect test patterns on product quality
- 8 July 2004
- conference paper
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 1, 1031-1040
- https://doi.org/10.1109/test.2003.1271091
Abstract
This paper presents the impact of multiple-detect test patterns on outgoing product quality. It introduces an ATPG tool that generates multiple-detect test patterns while maximizing the coverage of node-to- node bridging defects. Volume data obtained by testing a production ASIC with these new multiple- detect patterns shows increased defect screening capability and very good agreement with the bridging coverage estimated by the ATPG tool.Keywords
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