Novel photocurable epoxy siloxane polymers for photolithography and imprint lithography applications
- 1 January 2008
- journal article
- Published by American Vacuum Society in Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
- Vol. 26 (1), 244-248
- https://doi.org/10.1116/1.2834559
Abstract
Polyset epoxy siloxane (PES) polymer is ultraviolet (UV) curable with photoinitiator chemistry based on cationic polymerization. In the present work the authors have investigated the photodefinition characteristics of the epoxy siloxane polymers using photolithography and imprint lithography. The scanning electron microscopic images of the UV-cured patterns exhibit appealing resolution of micrometer scale features for photolithography processes. The imprint lithography has been examined with features smaller than 200 nm. In conjunction with the promising dielectric properties, epoxy siloxane polymers are particularly useful for applications such as the redistribution layer in packaging of integrated circuits.Keywords
This publication has 15 references indexed in Scilit:
- Processing dependent behavior of soft imprint lithography on the 1-10-nm scaleIEEE Transactions on Nanotechnology, 2006
- Stability of Cu on Epoxy Siloxane Polymer under Bias Temperature StressJournal of the Electrochemical Society, 2006
- A New Wafer Level Packaging Approach: Encapsulation, Metallization and Laser Structuring for Advanced System in Package ManufacturingJournal of Electronic Packaging, 2005
- Polyvinyl alcohol templates for low cost, high resolution, complex printingJournal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 2004
- Analysis of flip-chip packaging challenges on copper/low-k interconnectsIEEE Transactions on Device and Materials Reliability, 2003
- Patterned Transfer of Metallic Thin Film Nanostructures by Water-Soluble Polymer TemplatesNano Letters, 2003
- Linking with light [high-speed optical interconnects]IEEE Spectrum, 2002
- Improved Pattern Transfer in Soft Lithography Using Composite StampsLangmuir, 2002
- Sub-10 nm imprint lithography and applicationsJournal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 1997
- Imprint of sub-25 nm vias and trenches in polymersApplied Physics Letters, 1995