Thermal Issues in Next-Generation Integrated Circuits
- 1 December 2004
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Device and Materials Reliability
- Vol. 4 (4), 709-714
- https://doi.org/10.1109/tdmr.2004.840160
Abstract
The drive for higher performance has led to greater integration and higher clock frequency of microprocessor chips. This translates into higher heat dissipation and, therefore, effective cooling of electronic chips is becoming increasingly important for their reliable performance. We systematically explore the limits for heat removal from a model chip in various configurations. First, the heat removal from a bare chip by pure heat conduction and convection is studied to establish the theoretical limit of heat removal from a bare die bound by an infinite medium. This is followed by an analysis of heat removal from a packaged chip by evaluating the thermal resistance due to individual packaging elements. The analysis results allow us to identify the bottlenecks in the thermal performance of current generation packages, and to motivate lowering of thermal resistance through the board-side for efficient heat removal to meet ever increasing reliability and performance requirements.Keywords
This publication has 12 references indexed in Scilit:
- How well can we assess thermally driven reliability issues in electronic systems today? Summary of panel held at the Therminic 2002Microelectronics Journal, 2003
- Fundamental Performance Limits of HeatsinksJournal of Electronic Packaging, 2003
- Performance and testing of thermal interface materialsMicroelectronics Journal, 2003
- Critical Aspects of High-Performance Microprocessor PackagingMRS Bulletin, 2003
- Experimental determination of thermal conductivity of printed wiring boardsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Design and optimization of air-cooled heat sinks for sustainable developmentIEEE Transactions on Components and Packaging Technologies, 2002
- Analysis and optimization of thermal issues in high-performance VLSIPublished by Association for Computing Machinery (ACM) ,2001
- Thermally conductive EMC (epoxy molding compound) for microelectronic encapsulationPolymer Engineering & Science, 1999
- The development of component-level thermal compact models of a C4/CBGA interconnect technology: the Motorola PowerPC 603 and PowerPC 604 RISC microprocessorsIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1998
- Analysis of a thermally enhanced ball grid array packageIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1995