Thermally conductive EMC (epoxy molding compound) for microelectronic encapsulation
- 8 April 1999
- journal article
- research article
- Published by Wiley in Polymer Engineering & Science
- Vol. 39 (4), 756-766
- https://doi.org/10.1002/pen.11464
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Cure Kinetics of Epoxy Cresol Novolac Encapsulant for Microelectronics PackagingPublished by Springer Science and Business Media LLC ,1992
- Polymeric Materials for Electronics Packaging and InterconnectionPublished by American Chemical Society (ACS) ,1989