Crack detection in single-crystalline silicon wafers using impact testing
- 31 August 2008
- journal article
- research article
- Published by Elsevier BV in Applied Acoustics
- Vol. 69 (8), 755-760
- https://doi.org/10.1016/j.apacoust.2007.03.002
Abstract
No abstract availableThis publication has 5 references indexed in Scilit:
- Photoluminescence imaging of silicon wafersApplied Physics Letters, 2006
- Audible vibration diagnostics of thermo-elastic residual stress in multi-crystalline silicon wafersApplied Acoustics, 2006
- Crack detection and analyses using resonance ultrasonic vibrations in full-size crystalline silicon wafersApplied Physics Letters, 2006
- Resonance ultrasonic vibration diagnostics of elastic stress in full-size silicon wafersSemiconductor Science and Technology, 2006
- Photographic surveying of minority carrier diffusion length in polycrystalline silicon solar cells by electroluminescenceApplied Physics Letters, 2005