Crack detection and analyses using resonance ultrasonic vibrations in full-size crystalline silicon wafers
- 13 March 2006
- journal article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 88 (11)
- https://doi.org/10.1063/1.2186393
Abstract
No abstract availableThis publication has 4 references indexed in Scilit:
- Resonance ultrasonic vibration diagnostics of elastic stress in full-size silicon wafersSemiconductor Science and Technology, 2006
- VIBRATION OF CRACKED CIRCULAR PLATES AT RESONANCE FREQUENCIESJournal of Sound and Vibration, 2000
- Nonlinear resonance ultrasonic vibrations in Czochralski-silicon wafersApplied Physics Letters, 2000
- Surface-breaking fatigue crack detection using laser ultrasoundApplied Physics Letters, 1993