Improved adhesion property and electromagnetic interference shielding effectiveness of electroless Cu-plated layer on poly(ethylene terephthalate) by plasma treatment
- 28 February 2002
- journal article
- research article
- Published by Wiley in Journal of Applied Polymer Science
- Vol. 84 (7), 1369-1379
- https://doi.org/10.1002/app.10272
Abstract
No abstract availableKeywords
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