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A Mathematical Model for Electroless Copper Deposition on Planar Substrates
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A Mathematical Model for Electroless Copper Deposition on Planar Substrates
A Mathematical Model for Electroless Copper Deposition on Planar Substrates
MR
M. Ramasubramanian
M. Ramasubramanian
BP
B. N. Popov
B. N. Popov
RW
R. E. White
R. E. White
KC
K. S. Chen
K. S. Chen
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1 January 1999
journal article
Published by
The Electrochemical Society
in
Journal of the Electrochemical Society
Vol. 146
(1)
,
111-116
https://doi.org/10.1149/1.1391572
Abstract
A mathematical model for the electroless deposition of copper on a planar electrode is presented and used to make time‐dependent predictions on the various quantities in the system. The model takes into account mass transport by diffusion and migration, Butler‐Volmer kinetics at the electrode surface, and mixed potential theory. A finite difference approach is used to solve the equations, and the resultant model is used to predict the concentration profiles, potential response, and plating rate as a function of time and concentration of various reactive components. © 1999 The Electrochemical Society. All rights reserved.
Keywords
MIGRATION
FUNCTION
MODEL
COPPER
ELECTROLESS
PLANAR
PLATING
BUTLER
MIXED
MATHEMATICAL
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Cited by 26 articles