Development of novel low temperature bonding technologies for microchip chemical analysis applications
- 1 August 2000
- journal article
- Published by Elsevier BV in Sensors and Actuators A: Physical
- Vol. 84 (1-2), 103-108
- https://doi.org/10.1016/s0924-4247(99)00346-5
Abstract
No abstract availableKeywords
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