Consolidation of HIP bonding technologies for the ITER first wall panels
- 1 October 2007
- journal article
- Published by Elsevier BV in Fusion Engineering and Design
- Vol. 82 (15), 1806-1812
- https://doi.org/10.1016/j.fusengdes.2007.03.056
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
- EU R&D on the ITER First WallFusion Engineering and Design, 2006
- Development of a copper alloy to beryllium HIP bonding technology for the ITER first wallFusion Engineering and Design, 2005
- Manufacture of blanket shield modules for ITERFusion Engineering and Design, 2005
- Application of a diffusion bonding methodology to develop a Be/Cu HIP bond suitable for the ITER blanketFusion Engineering and Design, 2003
- The thermophysical and mechanical properties of the copper heat sink material intended for use in ITERFusion Engineering and Design, 2003
- Status of fabrication development for plasma facing components in the EUFusion Engineering and Design, 2002