Development of a copper alloy to beryllium HIP bonding technology for the ITER first wall
- 1 November 2005
- journal article
- Published by Elsevier BV in Fusion Engineering and Design
- Vol. 75-79, 377-381
- https://doi.org/10.1016/j.fusengdes.2005.06.137
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Manufacture of blanket shield modules for ITERFusion Engineering and Design, 2005
- Application of a diffusion bonding methodology to develop a Be/Cu HIP bond suitable for the ITER blanketFusion Engineering and Design, 2003
- The thermophysical and mechanical properties of the copper heat sink material intended for use in ITERFusion Engineering and Design, 2003