Numerical Analysis of Flow and Thermal Performance of Liquid-Cooling Microchannel Heat Sinks with Bifurcation
- 2 September 2013
- journal article
- research article
- Published by Taylor & Francis Ltd in Numerical Heat Transfer, Part A: Applications
- Vol. 64 (11), 902-919
- https://doi.org/10.1080/10407782.2013.807689
Abstract
Single-phase liquid-cooling microchannels have received great attention to remove the gradually increased heat loads of heat sinks. Proper changes of the flow path and/or heat transfer surface can result in much better thermal performance of microchannel heat sinks. In this study, a kind of rectangular straight microchannel heat sink with bifurcation flow arrangement has been designed, and the corresponding laminar flow and heat transfer have been investigated numerically. Four different configurations are considered. The effects of the bifurcation ratio (the initial channel number over the bifurcating channel number) and length ratio (the channel length before bifurcation over the bifurcation channel length) on laminar heat transfer, pressure drop, and thermal resistance are considered and compared with those of the traditional straight microchannel heat sink without bifurcation flow. The overall thermal resistances subjected to inlet Reynolds number and pumping power are compared for the five microchannel heat sinks. Results show that the thermal performance of the microchannel heat sink with bifurcation flow is better than that of the corresponding straight microchannel heat sink. The heat sinks with larger bifurcation ratio and length ratio provide much better thermal performance. It is suggested to employ bifurcation flow path in the liquid-cooling microchannel heat sinks to improve the overall thermal performance by proper design of the bifurcation position and number of channels.Keywords
This publication has 22 references indexed in Scilit:
- Comparative Study of Thermal Performance of Longitudinal and Transversal-Wavy Microchannel Heat Sinks for Electronic CoolingJournal of Electronic Packaging, 2013
- Analysis of Flow and Thermal Performance of a Water-Cooled Transversal Wavy Microchannel Heat Sink for Chip CoolingJournal of Electronic Packaging, 2012
- Numerical investigation of laminar heat transfer performance of various cooling channel designsApplied Thermal Engineering, 2011
- Fluid flow and heat transfer in wavy microchannelsInternational Journal of Heat and Mass Transfer, 2010
- Numerical Predictions of Heat Transfer and Flow Characteristics of Heat Sinks with Ribbed and Dimpled Surfaces in Laminar FlowNumerical Heat Transfer, Part A: Applications, 2008
- Cooling a Microprocessor ChipProceedings of the IEEE, 2006
- Investigation of heat transfer in rectangular microchannelsInternational Journal of Heat and Mass Transfer, 2005
- An experimental study of convective heat transfer in silicon microchannels with different surface conditionsInternational Journal of Heat and Mass Transfer, 2003
- Experimental and numerical study of pressure drop and heat transfer in a single-phase micro-channel heat sinkInternational Journal of Heat and Mass Transfer, 2002
- High-performance heat sinking for VLSIIEEE Electron Device Letters, 1981