Comparative Study of Thermal Performance of Longitudinal and Transversal-Wavy Microchannel Heat Sinks for Electronic Cooling
- 28 March 2013
- journal article
- Published by ASME International in Journal of Electronic Packaging
- Vol. 135 (2), 021008
- https://doi.org/10.1115/1.4023530
Abstract
Liquid cooling incorporating microchannels are used to cool electronic chips in order to remove more heat load. However, such microchannels are often designed to be straight with rectangular cross section. In this paper, on the basis of straight microchannels having rectangular cross section (SRC), longitudinal-wavy microchannel (LWC), and transversal microchannel (TWC) were designed, respectively, and then the corresponding laminar flow and heat transfer were investigated numerically. Among them, the channel wall of LWC undulates along the flow direction according to a sinusoidal function while the TWC undulates along the transversal direction. The numerical results show that for removing an identical heat load, the overall thermal resistance of the LWC is decreased with increasing inlet Reynolds number while the pressure drop is increased greatly, so that the overall thermal performance of LWC is inferior to that of SRC under the considered geometries. On the contrary, TWC has a great potential to reduce the pressure drop compared to SRC, especially for higher wave amplitudes at the same Reynolds number. Thus the overall thermal performance of TWC is superior to that of SRC. It is suggested that the TWC can be used to cool chips effectively with much smaller pressure drop penalty. In addition to the overall thermal resistance, other criteria of evaluation of the overall thermal performance, e.g., (Nu/Nu0)/(f/f0) and (Nu/Nu0)/(f/f0)1/3, are applied and some controversial results are obtained.Keywords
This publication has 27 references indexed in Scilit:
- Geometric optimization of a convective T-shaped cavity on the basis of constructal theoryInternational Journal of Heat and Mass Transfer, 2012
- Thermal-Structural Performance of Orthotropic Pin Fin in Electronics Cooling ApplicationsJournal of Electronic Packaging, 2012
- Constructal Design Applied to the Geometric Optimization of Y-shaped Cavities Embedded in a Conducting MediumJournal of Electronic Packaging, 2011
- Numerical Performance Analysis of Constructal I and Y Finned Heat Exchanging ModulesJournal of Electronic Packaging, 2009
- Numerical study of laminar heat transfer and pressure drop characteristics in a water-cooled minichannel heat sinkApplied Thermal Engineering, 2009
- Numerical Study of Turbulent Heat Transfer and Pressure Drop Characteristics in a Water-Cooled Minichannel Heat SinkJournal of Electronic Packaging, 2006
- Cooling a Microprocessor ChipProceedings of the IEEE, 2006
- Low Reynolds number forced convection in three-dimensional wavy-plate-fin compact channels: fin density effectsInternational Journal of Heat and Mass Transfer, 2005
- Optimal structure for microgrooved cooling fin for high-power LSI devicesElectronics Letters, 1986
- High-performance heat sinking for VLSIIEEE Electron Device Letters, 1981