Finite Element Calculations of Thermal Stresses in Passivated and Unpassivated Lines Bonded to Substrates
- 1 January 1990
- journal article
- Published by Springer Science and Business Media LLC in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
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- Stresses and deformation processes in thin films on substratesCritical Reviews in Solid State and Materials Sciences, 1988
- Measurement and Interpretation of stress in aluminum-based metallization as a function of thermal historyIEEE Transactions on Electron Devices, 1987
- Comments on Aleck’s Stress Distribution in Clamped PlatesJournal of Applied Mechanics, 1981
- Calculated elastic constants for stress problems associated with semiconductor devicesJournal of Applied Physics, 1973