Effects of Zn addition on mechanical properties of eutectic Sn–58Bi solder during liquid-state aging
- 1 April 2015
- journal article
- Published by Elsevier BV in Transactions of Nonferrous Metals Society of China
- Vol. 25 (4), 1225-1233
- https://doi.org/10.1016/s1003-6326(15)63719-0
Abstract
No abstract availableKeywords
This publication has 22 references indexed in Scilit:
- Morphology Characterization of Multi-Walled Carbon Nanotubes in Sn–58Bi/CNTs CompositesMATERIALS TRANSACTIONS, 2013
- Improvement of mechanical properties of Sn–58Bi alloy with multi-walled carbon nanotubesTransactions of Nonferrous Metals Society of China, 2012
- Interfacial reactions between Sn–57Bi–1Ag solder and electroless Ni-P/immersion Au under solid-state agingJournal of Materials Science, 2012
- Reactions of Sn-3.5Ag-Based Solders Containing Zn and Al Additions on Cu and Ni(P) SubstratesJournal of Electronic Materials, 2010
- Effect of Zn addition on the formation and growth of intermetallic compound at Sn–3.5wt% Ag/Cu interfaceJournal of Alloys and Compounds, 2008
- Effects of Trace Amounts of Rare Earth Additions on Microstructure and Properties of Sn-Bi-Based Solder AlloyJournal of Electronic Materials, 2008
- Effect of Zn on the intermetallics formation and reliability of Sn-3.5Ag solder on a Cu padJournal of Materials Research, 2007
- Interfacial reactions between molten Sn–Bi–X solders and Cu substrates for liquid solder interconnectsActa Materialia, 2006
- Interface Reaction and Mechanical Properties of Lead-free Sn-Zn Alloy/Cu JointsMATERIALS TRANSACTIONS, 2002
- Wetting and interface microstructure between Sn–Zn binary alloys and CuJournal of Materials Research, 1998