Low-pressure, high-temperature thermal bonding of polymeric microfluidic devices and their applications for electrophoretic separation
- 12 July 2006
- journal article
- Published by IOP Publishing in Journal of Micromechanics and Microengineering
- Vol. 16 (8), 1681-1688
- https://doi.org/10.1088/0960-1317/16/8/033
Abstract
No abstract availableThis publication has 21 references indexed in Scilit:
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