Finite element analysis of low temperature thermal nanoimprint lithography using a viscoelastic model
- 30 September 2008
- journal article
- Published by Elsevier BV in Microelectronic Engineering
- Vol. 85 (9), 1858-1865
- https://doi.org/10.1016/j.mee.2008.05.030
Abstract
No abstract availableKeywords
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