Direct liquid cooling of a stacked multichip module
- 27 August 2003
- conference paper
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
With the advances in microfabrication techniques and high performance chips, the heat flux from electronic components is reaching a point where air-cooling is unlikely to meet the cooling requirements for future generation computer chips. Direct single-phase liquid cooling of a stacked multichip module using FC-77 is examined in this paper. Three-dimensional numerical simulation is conducted to investigate the flow and the conjugated convection-conduction heat transfer in the cooling structure. The effects of the top clearance, the side clearance, flow rate, heating arrangement on the maximum chip temperature and velocity distribution are presented.Keywords
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