A review of 3-D packaging technology
- 1 January 1998
- journal article
- review article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
- Vol. 21 (1), 2-14
- https://doi.org/10.1109/96.659500
Abstract
No abstract availableThis publication has 28 references indexed in Scilit:
- Reliability and thermal characterization of a 3-dimensional multichip modulePublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Active silicon substrate technology for miniaturized ultra high performance processingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- 3D packaging technology overview and mass memory applicationsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- CVD diamond electronic packaging applicationsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- 3-D packaging-applications of vertical multichip modules (MCM-V) for microsystemsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- An ultra compact, low-cost, complete image-processing systemPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Three dimensional stacking with diamond sheet heat extraction for subnanosecond machine designPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Moore's law: past, present and futureIEEE Spectrum, 1997
- 2D matrix multiplication on a 3D systolic arrayMicroelectronics Journal, 1996
- Thermal characterization of vertical multichip modules MCM-VIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1995