Patterning Thin Film Mechanical Properties to Drive Assembly of Complex 3D Structures
- 16 December 2008
- journal article
- research article
- Published by Wiley in Advanced Materials
- Vol. 20 (24), 4760-4764
- https://doi.org/10.1002/adma.200801759
Abstract
No abstract availableKeywords
This publication has 33 references indexed in Scilit:
- Thin Film Stress Driven Self‐Folding of Microstructured ContainersSmall, 2008
- Multiphoton FabricationAngewandte Chemie-International Edition, 2007
- Surface Tension-Driven Self-Folding PolyhedraLangmuir, 2007
- Self-assembly of three dimensional micro mechanisms using thermal shrinkage of polyimideMicrosystem Technologies, 2006
- Fabrication of a spiral microcoil using a 3D-LIGA processMicrosystem Technologies, 2006
- Surface tension-powered self-assembly of microstructures - The state-of-the-artJournal of Microelectromechanical Systems, 2003
- Physical Origins of Intrinsic Stresses in Volmer–Weber Thin FilmsMRS Bulletin, 2002
- Finer features for functional microdevicesNature, 2001
- Making Negative Poisson’s Ratio Microstructures by Soft LithographyAdvanced Materials, 1999
- Three-Dimensional Metallic Microstructures Fabricated by Soft Lithography and MicroelectrodepositionLangmuir, 1999