In-air sintering of copper nanoparticle paste with pressure-assistance for die attachment in high power electronics
- 12 January 2021
- journal article
- research article
- Published by Springer Science and Business Media LLC in Journal of Materials Science: Materials in Electronics
- Vol. 32 (4), 4544-4555
- https://doi.org/10.1007/s10854-020-05196-4
Abstract
No abstract availableKeywords
Funding Information
- Materials innovation institute (T16017)
- National Natural Science Foundation of China (61704033)
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